MicroPUMPS

Innovative MicroPUMPS for infusion and injection biomedical devices

Papers on Smart MicroPUMPS

List of papers related to the engineering of micropumps and related sensors.

A Salette, R Lefevre, C Agraffeil, J Guillen, C Déhan, P Morfouli
and L Montès, "Thermal sensors cointegrated within a MEMS thermally actuated ultrathin membrane", Journal of Micromechanics and Microengineering 22-6 p.9 (2012 )
http://dx.doi.org/10.1088/0960-1317/22/6/065029

 

 

R. Lefèvre, A. Salette, C. Agraffeil, J. Guillen, C. Déhan, P. Morfouli, and
L. Montès, "Numerical study of bimetallic actuated micro-membrane with large deformations", Journal of Micromechanics and Microengineering, 23, 015011 (2013)
doi:10.1088/0960-1317/23/1/015011

 

Soon to come:

- L. Montès et al, "Smart MEMS micropumps for medical devices" (talk)
Biomedical MEMS and Sensors 2013, April 16-18, 2013 – Cleveland, Ohio - USA

- D.Rabaud, R. Lefevre, A. Salette, L. Dargent, H. Marko, Q. Le Masne, C. Déhan, P. Morfouli and L. Montès, "Thermal actuated micropump for biological and medical application" (talk)
SPIE Microtechnologies, 24-25 april 2013 - Grenoble - FranceProceedings of SPIE Volume 8765

 

Other papers & Conferences:

A. Salette, R. Lefevre, J. Guillen, C. Agraffeil, C. Déhan, L. Montès, P. Morfouli, "Thermal sensors integrated within a CMOS compatible thermally actuated membrane", Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPad), Grenoble, France (25-26 avril 2012) - Best Poster Award

R. Lefevre, A. Salette, C. Agraffeil, J. Guillen, L. Montès, P. Morfouli, C. Déhan, "CMOS compatible thermally actuated micro-membrane for large deformations", Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum (MiNaPad), Grenoble, France (25-26 avril 2012)

R. Lefevre,  A. Salette, C. Déhan, P. Morfouli, L. Montès, "IC compatible thermal actuated micromembrane for large deformations", MNE2012 / 38th International Conference on Micro and Nano Engineering, Toulouse, France (2012)

A. Salette, R. Lefevre, C. Déhan, P. Morfouli, L. Montès, "Adaptative microfluidic package with high pressure fluidic connectors", MNE2012 / 38th International Conference on Micro and Nano Engineering, Toulouse, France (2012)

A. Salette, R. Lefevre, C. Déhan, P. Morfouli, L. Montès, "A New Method to Extract Piezoresistive Coefficients in Polysilicon Through Gauges Placed on a MEMS Membrane", Procedia Engineering V47, 2012, pp. 426-429     http://dx.doi.org/10.1016/j.proeng.2012.09.175

R. Lefevre , A. Salette , L. Montès , P. Morfouli , C. Déhan, "Fully Integrated Thermally Actuated SOI Diaphragm: Design, Fabrication & Characterization", IEEE ISCDG, proceedings pp. 195-198, Grenoble, France (2012)     10.1109/ISCDG.2012.6360021

L. Montès , P. Morfouli, B. Perrière, "Fluid circulation member, and fluid circulation assembly including at least one of such a member", International Patent - WO2010/139913A1

Other related Papers on other MEMS devices

List of toher papers related to the engineering of MEMS and other sensors.

Flow sensors / Spirometers:
M. Lagrouche, L. Montès, J. Boussey, S. Arneur, “Low-cost embedded spirometer based on micro machined polycrystalline thin film”, Flow Measurement and Instrumentation, 22-2 pp.126-130 (2011)  
DOI: 10.1016/j.flowmeasinst.2010.12.012

M. Laghrouche, L.Montès, J. Boussey ,D.Meunier, S. Ameur and A.Adane, "In situ Calibration of Wall Shear Stress Sensor For micro Fluidic Application"
Procedia Engineering 25 (2011) pp.1225 – 1228
http://dx.doi.org/10.1016/j.proeng.2011.12.302
Also in Proc. Eurosensors XXV, September 4-7, 2011, Athens, Greece

HeatSpreader & MicroFluidics:
B. Bercu, L. Montès, P. Morfouli, “SOI built-in heatspreader with temperature and pressure integrated sensors for cooling optimization and insitu monitoring”, Materials Science and Engineering B (2011),
http://dx.doi.org/10.1016/j.mseb.2010.10.004

B. Bercu, L. Montès, P. Morfouli, “FEA Calculations for Ultra Thin Piezoresistive Pressure Sensor on SOI for Heatspreader Integration”, IEEE Proceedings, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSime), 24-26 April 2006, pp. 1-6
   10.1109/ESIME.2006.1643958

Contact

More info:info@micropumps.fr

montes@micropumps.fr
Ph: +33 456 529 527

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